发明名称 Printed circuit board assembly with stiffening brace for ball-grid array device
摘要 An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is removably secured to the first side of the circuit board at the mounting holes.
申请公布号 US2006171129(A1) 申请公布日期 2006.08.03
申请号 US20050049474 申请日期 2005.02.02
申请人 BERTO THOMAS E;VAZE ANIRUDH N 发明人 BERTO THOMAS E.;VAZE ANIRUDH N.
分类号 H05K7/02 主分类号 H05K7/02
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