IMAGE PICKUP DEVICE

摘要

An image pickup device by which mass production and cost reduction can be easily achieved while maintaining size reduction, thickness reduction and high performance. The image pickup device is provided with a solid-state image pickup element (101), a printed board (103), and a signal processing IC chip (104). The signal processing IC chip (104) processes a signal outputted from the solid-state image pickup element (101). The printed board (103) is composed of a rigid flexible substrate whereupon a through hole (107) into which a protruding section (102) of the signal processing IC chip (104) can be inserted is formed. The solid-state image pickup element (101) is directly mounted on one surface of the rigid section of the printed board (103). The signal processing IC chip (104) is mounted on an IC chip mounting substrate (105) arranged on the other surface of the rigid section of the printed board (103).