发明名称 RADIATION SENSITIVE RESIN COMPOSITION, INTERLAYER INSULATION FILM AND MICROLENS
摘要 <P>PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition etc. having high sensitivity and a good development margin, capable of forming an interlayer insulation film having excellent solvent resistance, heat resistance, light transmittance, relative dielectric constant, etc. and capable of forming microlenses having excellent solvent resistance, heat resistance, light transmittance etc. and a good melt shape. <P>SOLUTION: The radiation sensitive resin composition contains [A] an alkali-soluble copolymer comprising (a1) an unsaturated carboxylic acid (anhydride), (a2) an unsaturated compound having a (tetrahydro)furan ring structure, a (tetrahydro)pyran ring structure or a structure represented by formula (1) (where R denotes H or methyl and n is an integer of 2-10), and (a3) an unsaturated compound other than the above compounds, and [B] a 1,2-quinonediazido compound. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006201549(A) 申请公布日期 2006.08.03
申请号 JP20050013854 申请日期 2005.01.21
申请人 JSR CORP 发明人 HANAMURA MASAAKI;HAMADA KENICHI;TAKAMOTO EIJI;MINOWA TAKAKI
分类号 G03F7/033;G02B1/04;G02B3/00;G03F7/004;G03F7/022;G03F7/40;H01L21/027 主分类号 G03F7/033
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