发明名称 PROCESSING EQUIPMENT AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide processing equipment in which cleaning can be carried out while preventing contact with outer air in a non-open system, and the effect of abrupt variation in flow rate can be reduced. SOLUTION: A gas space 24 as a pressure regulating means is formed above a pressure regulation chamber 21f of small volume for a main chamber 21g in a chamber 21 wherein the pressure regulation chamber 21f is communicating, at a lower portion thereof, with the main chamber 21g. At an upper portion of the pressure regulation chamber 21f, a gas introduction opening 29 for introducing N<SB>2</SB>gas or IPA vapor into the chamber 21 is formed and at an intermediate position of the pressure regulation chamber 21f, a gas/liquid discharge opening 28 for discharging various kinds of cleaning liquid or gas is provided. Since gas is introduced into the gas space 24, elevation of liquid level S is absorbed by the gas space 24 when the flow rate of cleaning liquid increases and pressure variation is relaxed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006202795(A) 申请公布日期 2006.08.03
申请号 JP20050009775 申请日期 2005.01.18
申请人 TOKYO ELECTRON LTD 发明人 KAMIKAWA YUJI
分类号 H01L21/304;B08B3/04;B08B3/12;G02F1/13;G02F1/1333;H01L21/677 主分类号 H01L21/304
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