CARRIERS FOR SEMICONDUCTOR PACKAGES, SEMICONDUCTOR PACKAGES AND METHODS TO ASSEMBLE THEM

摘要

A carrier for a semiconductor package (30; 31) comprises at least one package position (1; 28). Each package position (1; 28) includes a chip mounting area (3; 18), at least one grounding area (8; 22) and an electrically conductive redistribution structure (2; 17). The redistribution structure (2; 17) includes inner contact pads (4; 21). The carrier further includes at least one precursor bump (9; 23) disposed on the carrier.