发明名称 Semiconductor device having directly attached heat spreader
摘要 An apparatus consisting of a leadframe ( 301 ) and a metallic heat spreader ( 310 ). The leadframe, made of a planar metal sheet, includes a plurality of non-coplanar members ( 312 ) operable as mechanical couplers configured to grip inserted objects. The heat spreader has a central pad ( 310 ) suitable for mounting a heat-generating object, and a plurality of handles ( 312 ) in locations to match the members; the handles are coupled with the members. One member end is formed as a clamp having projections from the planar sheet, operable to grip one of the handles, when it is inserted into the coupler, and also has a bend so that the plane of the heat spreader, after insertion of its handles into the clamps, is spaced from the plane of the leadframe. A gap is thus created between the spreader and the first leadframe segment ends.
申请公布号 US2006170080(A1) 申请公布日期 2006.08.03
申请号 US20050050059 申请日期 2005.02.03
申请人 发明人 ZUNIGA-ORTIZ EDGAR R.;SAYE RICHARD J.;WRIGHT LANCE C.
分类号 H01L23/495 主分类号 H01L23/495
代理机构 代理人
主权项
地址