| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor chip manufacturing method, capable of reducing the variation and positional dislocation of the volume of a hollow reaction part, particularly, the sensor chip manufacturing method capable of reducing the variation and the positional dislocation of the volume, even if the hollow reaction part is a small quantity of volume, and to provide a sensor chip manufacturable by using this method. <P>SOLUTION: In this manufacturing method of the sensor chip, having a base board, a cover layer, a spacer layer arranged between the base board and the cover layer, and the hollow reaction part arranged in the spacer layer, the sensor chip manufacturing method has a process of forming the hollow reaction part by one or a plurality of clearances between tapes by forming the spacer layer, by sticking two or more of pressure-sensitive adhesive or adhesive tapes on a sheet for forming a plurality of base boards or the plurality of boards. The sensor chip can be manufactured by this method. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
