| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive polymer composition which exhibits good photosensitive properties before imidation of a polyimide precursor and excels in low thermal expansibility (reduced stress) after imidation, a relief pattern producing method by which high resolution and a good pattern shape are obtained and by which a surface protective film, an interlayer insulation film or the like of a semiconductor device can be manufactured with ease, and electronic components obtained by the producing method. SOLUTION: The photosensitive polymer composition contains (a) the polyimide precursor and a polyimide, (b) a photopolymerization initiator and (c) an aromatic diamine compound. The relief pattern producing method includes a step of applying and drying the photosensitive polymer composition on a support substrate, an exposure step, a development step and a heat treatment step. The electronic components are also provided. COPYRIGHT: (C)2006,JPO&NCIPI |
