摘要 |
PROBLEM TO BE SOLVED: To provide a non-silicone type high heat-conductive resin composition which has high heat conductivity, has hardness easy to handle at ordinary temperatures on the one hand, but exhibits high flexibility at a predetermined temperature or higher on the other hand, and excels in processability as well. SOLUTION: The high heat-conductive resin composition comprises (A) a thermoplastic elastomer, (B) a side chain crystalline polymer, and (C) a high heat-conductive filler and meets the following relationships: (1) 0.05≤[a]+[b]≤0.8, (2) 0.05≤[b]/[a]≤5, and (3) 0.2≤[c]≤0.95, when the mass fraction of the above each component based on the total amount of components (A), (B), and (C) is taken as [a], [b], and [c], respectively. COPYRIGHT: (C)2006,JPO&NCIPI
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