Polishing tool and polishing apparatus

摘要

A polishing tool is used for polishing a workpiece ( 13 ) such as a semiconductor wafer to a flat mirror finish. The polishing tool has a polishing table ( 10 ) and a polishing pad ( 11 ) attached to an upper surface of the polishing table ( 10 ). The polishing pad ( 11 ) has a plurality of polishing pad pieces ( 111 ) attached to the polishing table ( 10 ). It is possible to facilitate adjustment of polishing performance over a surface of the workpiece ( 13 ) and replacement of a polishing pad ( 10 ).