发明名称 METHOD OF ADJUSTING SURFACE TEMPERATURE DISTRIBUTION IN ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of adjusting the surface temperature distribution in an electronic apparatus which can suppress a local increase in surface temperature in the electronic apparatus. <P>SOLUTION: The method of adjusting the surface temperature distribution in an electronic apparatus comprises an outer packaging case 1 of the electronic apparatus, a heating electronic component 3 stored in the outer packaging case 1, and a graphite sheet 5 which is arranged inside the outer packaging case 1 and distributes local heat generated from the heating electronic component 3 within a predetermined range. A through hole 6 is formed in a region of the graphite sheet 5 facing the heating electronic component 3. The surface temperature of the electronic apparatus is adjusted by adjusting the diameter of the through-hole 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006203018(A) 申请公布日期 2006.08.03
申请号 JP20050013640 申请日期 2005.01.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAWAMURA NORIHIRO;KUBO KAZUHIKO;HABATA ETSURO;SENBA MASASHI;HORI YOSHIKAZU
分类号 H05K7/20;G06F1/20;H01L23/36 主分类号 H05K7/20
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