MOLD CAVITY IDENTIFICATION MARKINGS FOR IC PACKAGES

摘要

Small feature identifying markings (24) are provided for tracing completed IC (integrated circuit) packages (20) to individual mold cavities. Preferred embodiments of the invention include IC packages and associated methods for forming indicia in a surface of an integrated circuit package in an arrangement indicative of a particular mold cavity. The indicia may be read to determine the particular mold cavity associated with the manufacture of an individual integrated circuit package. Preferred embodiments of the invention are included using surface dots or indentation indicia configured in a binary code arrangement.