ELECTRONIC ELEMENT PACKAGE MANUFACTURING METHOD AND ELECTRONIC ELEMENT PACKAGE

摘要

By connecting a base member (2) to a cover member (3), an internal electrode (51) in contact with the cover member (3) and an electronic element (41) connected to the internal electrode are arranged in an internal space (61) between the base member and the cover member. A through hole (32) reaching the surface of the internal electrode is formed by etching a surface (31) of the cover member opposing to the base member by a predetermined method. A conductive member is attached to the through hole and an external electrode connected to the internal electrode is formed on the surface. Thus, a thin electronic element package (1) is completed.