| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which fusion and fluid deformation are suppressed, variation in positional precision is eliminated in the laminating direction, readjustment of a process is not required, and high reliability is ensured in interlayer electrical connection when laminating by a batch. SOLUTION: Wiring boards 1, 2 and a wiring board 3 are laminated alternately and produce a laminate by a batch lamination method. For the wiring boards 1, 2, a film, a thin plate or a sheet-like insulating substrate 11 made of a thermosetting resin principally comprising any one of an epoxy resin, a bismaleimide/triazine resin, and an arylated polyphenylene ether resin is used and, for the wiring board 3, a film, a thin plate or a sheet-like insulating substrate 21 made of a thermosetting resin containing a polyaryl ketone resin having a crystal dissolution peak temperature of 260°C or above, and an amorphous polyetherimide resin. COPYRIGHT: (C)2006,JPO&NCIPI |
