发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>A semiconductor device and equipment for manufacturing same are provided with a semiconductor substrate (200) having a source region (210) and a drain/cathode common region (220); a gate (240) formed on the semiconductor substrate; a diode wherein a cathode is connected with a drain in the drain/cathode common region; and a bit line (260) connected with an anode (222) of the diode. Thus, a potential difference between a connecting hole (265) and a control gate (240) is reduced for data erasure, and short-circuit is eliminated in a region (245) between the connecting hole (265) and the control gate (240). As a result, the region between the connecting hole and the control gate is microminiaturized, and a nonvolatile memory wherein a memory cell is microminiaturized can be provided.</p> |
申请公布号 |
WO2006080064(A1) |
申请公布日期 |
2006.08.03 |
申请号 |
WO2005JP01084 |
申请日期 |
2005.01.27 |
申请人 |
SPANSION LLC;SPANSION JAPAN LIMITED;SUGISAKI, MASAO;KABASHIMA, KATSUHIKO;TANAKA, TOSHIYUKI |
发明人 |
SUGISAKI, MASAO;KABASHIMA, KATSUHIKO;TANAKA, TOSHIYUKI |
分类号 |
H01L21/8247;G11C16/04;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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