发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 <p>A semiconductor device and equipment for manufacturing same are provided with a semiconductor substrate (200) having a source region (210) and a drain/cathode common region (220); a gate (240) formed on the semiconductor substrate; a diode wherein a cathode is connected with a drain in the drain/cathode common region; and a bit line (260) connected with an anode (222) of the diode. Thus, a potential difference between a connecting hole (265) and a control gate (240) is reduced for data erasure, and short-circuit is eliminated in a region (245) between the connecting hole (265) and the control gate (240). As a result, the region between the connecting hole and the control gate is microminiaturized, and a nonvolatile memory wherein a memory cell is microminiaturized can be provided.</p>
申请公布号 WO2006080064(A1) 申请公布日期 2006.08.03
申请号 WO2005JP01084 申请日期 2005.01.27
申请人 SPANSION LLC;SPANSION JAPAN LIMITED;SUGISAKI, MASAO;KABASHIMA, KATSUHIKO;TANAKA, TOSHIYUKI 发明人 SUGISAKI, MASAO;KABASHIMA, KATSUHIKO;TANAKA, TOSHIYUKI
分类号 H01L21/8247;G11C16/04;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
代理机构 代理人
主权项
地址