256 MEG DYNAMIC RANDOM ACCESS MEMORY

摘要

PROBLEM TO BE SOLVED: To provide a method for sealing a solid state device in a design of a dynamic random access memory (DRAM) which is an integrated circuit memory. SOLUTION: The method is provided for sealing the solid state device in which a lead frame is connected to a joint pad. In the method, a tie bar serves as a holder for a lead finger under sealing treatment. It is preferable that a part of the lead frame forms a part of an electric circuit of the solid state device. Moreover it is preferable that the method includes a process for cutting the tie bar. COPYRIGHT: (C)2006,JPO&NCIPI