| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board with stiffening plate, with which productivity can be improved while the stiffening plate can highly precisely be positioned and laminated. SOLUTION: An adhesive layer 2 is laminated on a metal support substrate 1, and a flexible wiring circuit board 4 is laminated on the metal support substrate 1 through the adhesive layer 2 by a roll-to-roll system. The metal support substrate 1 is worked into a prescribed pattern by the roll-to-roll system, and the stiffening plate 10 is formed. The flexible wiring circuit board with stiffening plate can be manufactured with sufficient productivity, and the stiffening plate 10 can highly precisely be positioned and laminated with respect to the flexible wiring circuit board 4. COPYRIGHT: (C)2006,JPO&NCIPI
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