| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film which can be resisted to a soft soldering and reflow under strict conditions of moisture and can be well used as a flexible printed circuit (FPC) board while keeping an adhesion with the adhesive film and a metal foil. SOLUTION: The adhesive film comprises a highly heat resistant polyimide layer, an adhesive layer containing a thermoplastic polyimide formed in at least one surface of the highly heat resistant polyimide layer, in which the adhesive film includes 0.5-30 wt% of a non-thermoplastic polyimide composed of the highly heat resistant polyimide layer. COPYRIGHT: (C)2006,JPO&NCIPI
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