| 摘要 |
A semiconductor device comprises: a plurality of first wiring lines formed in a first layer with a first wiring width and a first wiring space; a plurality of second wiring lines formed in a second layer different from the above-described first layer with a second wiring width and a second wiring space larger than the above-described first wiring width and first wiring space; and a contact plug connecting the first wiring line and second wiring line. The above-described contact plug is formed over a plurality of adjacent ones of the above-described first wiring lines and has a pattern connecting the plurality of adjacent ones of the above-described first wiring lines and one of the above-described second wiring lines.
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