发明名称 |
Soldering method and apparatus |
摘要 |
There are provided a solder ball deforming step of mechanically deforming a ball to break an oxide film of a surface thereof and to expose a nonoxide surface and a solder melting step of heating and melting the deformed solder ball through energy irradiation in a state where the deformed solder ball is mounted on joint units of a loaded work. The solder ball deforming step mechanically deforms the solder ball to form at least two orthogonal contact surfaces in contact with the joint surfaces of the joint units.
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申请公布号 |
US2006169750(A1) |
申请公布日期 |
2006.08.03 |
申请号 |
US20050139789 |
申请日期 |
2005.05.31 |
申请人 |
FUJITSU LIMITED |
发明人 |
TANAKA HISAO;FUJII MASANAO;OKADA TORU;IIDA SUSUMU;YAMANISHI HIROKAZU;NODA YUTAKA |
分类号 |
B23K1/005 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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