HEAT EXCHANGER FOR SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a heat exchanger capable of improving a heat transmission between a chip and a heat sink. SOLUTION: This invention relates to a method and an apparatus for cooling a heat source. In one practical embodiment a heat exchanger 100 is provided. This includes a passage 114 for receiving cooling liquid 112 which is provided with a first front surface 106 and a facing second front surface 104. In the passage 114 there is arranged a mesh plug 110 by which the cooling liquid 112 is mixed so as to generate a turbulent flow in the passage 114. The first front surface 106 of the passage 114 is arranged adjacent to a semiconductor heat source 102. In the one practical embodiment the first front surface 106 includes plastic. In the one practical embodiment the second front surface 104 includes a metal like copper for example. In the one practical embodiment the mesh plug 110 includes a copper mesh covered with nickel. COPYRIGHT: (C)2006,JPO&NCIPI