| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a bonded substrate improving a yield of the bonded substrate by preventing occurrence of bending of the substrate in the conveyance and sucking process of substrates before bonding the substrates. SOLUTION: The apparatus for manufacturing the bonded substrate, by which two substrates are respectively sucked to the holding plates in a treatment chamber to bond them each other, comprises: lots of sucking means 40a to 40c provided on the holding plates 20 to suck the substrates; and a suction control means for controlling the sucking means so that they suck the substrates from the center toward the periphery when sucking the substrates to the holding plates 20. COPYRIGHT: (C)2006,JPO&NCIPI |
