发明名称 |
Socket adapted for compressive loading |
摘要 |
A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold the Socket BGA to the circuit substrate with a compressive load isolated from the heat sink.
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申请公布号 |
US2006171122(A1) |
申请公布日期 |
2006.08.03 |
申请号 |
US20050046452 |
申请日期 |
2005.01.28 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
MALONE CHRISTOPHER G.;BARSUN STEPHAN K. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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