| 摘要 |
The present invention provides a new technology approach for forming a contact layer in a microelectronic chip, which includes a plurality of solder bumps that are directly to be connected with a correspondingly designed carrier substrate. In the process flow, a plasma-based process for patterning the underbump metallization layer is used in combination with testing and assembling the device, thereby providing a high degree of process flexibility and/or cost reduction and/or device performance.
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