| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device where adhesiveness of a substrate formed of an insulating film and anisotropic conductive adhesive is improved and an additional adhesion reinforcing material can be eliminated, and to provide a display model and a manufacturing method of the semiconductor device. <P>SOLUTION: In the semiconductor device 10, a semiconductor chip 4 having wiring patterns 2 and 3 is mounted on a substrate 1 formed of the insulating film consisting of an organic substance. The substrate is electrically connected to a liquid crystal display panel 21 and a PW substrate 30 with anisotropic conductive adhesive 11. A processing is performed on at least one surface of the insulating film with silicon coupling agent 31. Then, 0.5 to 12.0 atomic% (surface element concentration) of silicon (Si) exists on the surface of the insulating film as a configuration element of silicon coupling agent. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
