ELECTRONIC COMPONENT PACKAGING BAND, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a strip-shaped electronic component packaging band of an electronic component which is automatically mounted mainly on a wiring board or the like of various electronic instruments and used, and its manufacturing method in which dust or the like hardly enters in a housing part, and a reliably automatic mounting work is possible.

SOLUTION: Ingress of dust or the like into an accommodation part 11A is prevented by protruding a projecting part 12B having no hole or the like with a tip thereof having a substantially curved surface on a face opposite to an electronic component 2 on a lower side of a cover tape 12 to cover an upper opening part of the housing part 11A of a carrier tape 11, adhesion of the electronic component to the lower side of the cover tape 12 with oil is prevented, and an electronic component packaging band to be reliably and automatically mounted can be obtained.

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