| 摘要 |
PROBLEM TO BE SOLVED: To provide a void-free multilayer polyimide flexible circuit board. SOLUTION: In a method for manufacturing the multilayer polyimide flexible circuit board, the conductor foil surface of a conductive foil application substrate with a polyimide resin as a base and the polyimide layer of another similar conductive foil application substrate are overlapped so that they are in contact each other via a precured polyimide film, and are cured at high temperature in a pressurized state. In this case, conductor foil that becomes an inner layer is coated with polyimide 230, which is soft-baked at 100-150°C for 20-90 minutes, and is precured for 20-90 minutes at 170-250°C. The conductor foil having the precured imide layer and the imide layer of another conductor foil-spread substrate are overlapped so that they are in contact each other, and are cured at a high temperature of 250-350°C for 20-240 minutes in a pressurized state. COPYRIGHT: (C)2006,JPO&NCIPI |
