| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can increase a distance between pads for external connection and can increase the width of wiring lines or an interval therebetween. <P>SOLUTION: In a semiconductor device 16, pads 7 for external connection to be electrically connected with a plurality of electrode pads 1 are provided on the main surface of a semiconductor chip 10 having the plurality of electrode pads 1 formed thereon, and on the same surface of a sealing resin 3 as the main surface of the semiconductor chip covering side faces of the semiconductor chip 10 and the surface of the chip 10 opposed to the main surface of the chip 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
