| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold having high heat insulating properties, capable of keeping a predetermined temperature at the initial and final stages of the filling into a cavity, excellent in the flowability of a resin and the transfer properties of a molding surface. SOLUTION: The mold for molding a resin is characterized in that an electroless plating layer is formed on the molding surface of the mold on the matrix side thereof, a surface layer comprising an amorphous silicon carbide film is formed on the molding surface of the mold and the content of Si in the amorphous silicon carbide film is 60 wt.% or above. COPYRIGHT: (C)2006,JPO&NCIPI |
