| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat management system for electronic assembly capable of efficiently cooling an electronic structural member. SOLUTION: A heat management system 100 for electronic assembly comprises an integrated circuit package 102 coupled with a substrate 104, the substrate 104 coupled with a cold plate 110, a spring member 114 arranged in between the integrated circuit package 102 and the cold plate 110 and engaged with the package and the plate, and a heat transmitting element 116 arranged in a chamber 115 formed of the spring member 114. Effective heat transmission from the integrated circuit package 102 to the cold plate 110 is promoted. COPYRIGHT: (C)2006,JPO&NCIPI |
