发明名称 |
Wet etching the edge and bevel of a silicon wafer |
摘要 |
A method and apparatus to selectively etch layers of various materials from the edge and bevel areas of the active side of a silicon wafer, as well as from the inactive side of a wafer are disclosed. The width of the etched edge generally varies from about 0.5 to about 5 mm and however the etching may be determined by the geometry of the supporting chuck and the surface tension of the etching medium.
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申请公布号 |
US2006172538(A1) |
申请公布日期 |
2006.08.03 |
申请号 |
US20050294644 |
申请日期 |
2005.12.05 |
申请人 |
ITZKOWITZ HERMAN;TADDEI JOHN |
发明人 |
ITZKOWITZ HERMAN;TADDEI JOHN |
分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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