发明名称 PULSE THERMAL PROCESSING OF FUNCTIONAL MATERIALS USING DIRECTED PLASMA ARC
摘要 A method of thermally processing a material includes the steps of providing an article having a surface film disposed on a substrate, and exposing the thin film to at least one incident pulse of infrared comprising radiation at a power density of at least 0.1 kW/cm<SUP>2</SUP> emitted from a directed plasma arc to thermally process the thin film. The at least one pulse has a duration of no more than 10 s. The method provides a radiation intensity and spectrum of radiation capable of heating the surface film to the desired temperature while allowing the substrate to remain at a lower temperature. This feature permits use of substrates that generally are not high temperature tolerant, such as certain polymer substrates.
申请公布号 WO2006015328(A3) 申请公布日期 2006.08.03
申请号 WO2005US27301 申请日期 2005.08.01
申请人 UT-BATTELLE, LLC.;OTT, RONALD, D.;BLUE, CRAIG, A.;DUDNEY, NANCY, J.;HARPER, DAVID, C. 发明人 OTT, RONALD, D.;BLUE, CRAIG, A.;DUDNEY, NANCY, J.;HARPER, DAVID, C.
分类号 C23C4/18;B05D3/14;C23C2/26;G11B5/84;H01L21/263;H01L21/268;H01L31/00 主分类号 C23C4/18
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