发明名称 MANUFACTURING METHOD FOR PLATED FILM, AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for a plated film that provides superior productivity, as well as providing a plated film with proper peelability and moreover without curvature. SOLUTION: This is a manufacturing method for a plated film, that has steps of making a metal plated film 8 deposited on a substrate 9 columnar or cylindrical surface, making the surface part of the metal plated film 8 that was deposited, and transferring the metal plated film 8, whose surface part has been remelted, from the substrate 9 to a transferred material 21. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006203221(A) 申请公布日期 2006.08.03
申请号 JP20060039214 申请日期 2006.02.16
申请人 KYOCERA CORP 发明人 NAKAGAWA ATSUSHI;SAKODA HIDETO;KITA KATSUNORI;IKEUCHI KOICHIRO
分类号 H01G4/30;C25D1/00;H01G4/12 主分类号 H01G4/30
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