发明名称 PROCESS FOR MANUFACTURING LEAD FRAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a process for manufacturing a lead frame in which a segment block does not project from the upper surface of a resin molding portion, the segment block can be positioned even if it cannot be clamped, and resin burrs are not generated even if the segment block is projecting from the upper surface of the resin molding portion. <P>SOLUTION: A segment block 2 can be positioned at a through hole 3a without generating resin burr by a manufacturing process comprising a step for forming a first resin molding portion 3 having a predetermined through hole 3a in a space surrounded by the distal end of a plurality of lead portions 1a of a metal plate material 1, a step for inserting the segment block 2 into the through hole 3a, and a step for forming a second resin molding portion 4 on the outside of the first resin molding portion 3 of a lead structure formed in the segment block insertion step. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006202803(A) 申请公布日期 2006.08.03
申请号 JP20050009872 申请日期 2005.01.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAWARA TSUNAICHI
分类号 H01L33/54;H01L23/50;H01L33/56;H01L33/62;H01L33/64 主分类号 H01L33/54
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