| 摘要 |
A nanostructure (10) for joining a device (24) to substrate (12) comprising providing each of the substrate (12) and device (24) with filaments (16, 18, 20 & 22) arranged to interdigitate when moved towards each other. The filaments (18) may be nanotubes formed and deposited by a variety of means. The nanostructure (10) finds particular application in the electronics industry where relative shape changes occur, where non-flat surfaces are to be joined and where direct growth of devices on certain substrates is contraindicated. The nanostructure (10) can also be used as a general-purpose joint, e.g. in the aerospace industry. A method of joining and a method of manufacturing the nanostructure (10) are also disclosed. |
