发明名称 CONDUCTIVE PASTE
摘要 <p>A conductive paste having an excellent conductivity and an excellent conductive connection reliability contains a binder containing a thermosetting resin, and conductive particles. The lowest heat generation peak temperature T&lt;SUB&gt;1&lt;/SUB&gt; (degrees C) among at least one heat generation peak obtained by a differential scanning calorie measurement of the binder and the lowest heat absorption peak temperature t&lt;SUB&gt;1&lt;/SUB&gt; (degrees C) among at least one heat absorption peak obtained by the differential scanning calorie measurement of the conductive particles satisfy the following relationship: t&lt;SUB&gt;1&lt;/SUB&gt; - 20 &lt; T&lt;SUB&gt;1&lt;/SUB&gt; ...(1).</p>
申请公布号 WO2006080247(A1) 申请公布日期 2006.08.03
申请号 WO2006JP300829 申请日期 2006.01.20
申请人 FUJIKURA KASEI CO., LTD.;ASAHI KASEI EMD CORPORATION;HIRAKAWA, YOHEI;WAKABAYASHI, KATSUTOMO;YOTSUYANAGI, YUTA;TANAKA, NORIHITO 发明人 HIRAKAWA, YOHEI;WAKABAYASHI, KATSUTOMO;YOTSUYANAGI, YUTA;TANAKA, NORIHITO
分类号 H01B1/22;H05K1/09 主分类号 H01B1/22
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