| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a solar cell module capable of inexpensively forming a p-type semiconductor layer by using electrolytic plating capable of easily increasing in size, compared to an evaporation method or a sputtering method. <P>SOLUTION: A plurality of p-type semiconductor layers 16 divided by a first groove 14 of a predetermined width having a substrate surface exposed to the bottom surface are formed by utilizing electrolytic plating using an electrode film 12 formed on one surface side of the substrate 10 as a power feeding layer. After that, an overall n-type semiconductor layer 18a covering each surface of the p-type layers 16 and the exposed surface of the substrate 10 exposed on the bottom surface are formed of the first groove 14. Subsequently, a second groove 20 is formed in which the electrode film 12 formed near the first groove 14 of one of the layers 16, 16 adjacent to each other via the first groove 14 is exposed to the bottom surface, the layer 18a is patterned on an n-type semiconductor layer 18 of a predetermined shape, and then, the second groove 20 is filled and an overall transparent electrode 22a covering the entire surface of the layer 18 is formed. After that, a third groove 24 is formed in which the top surface positioned inner than the second groove 20 of the electrode film 12 having the second groove 20 formed on the top surface side is exposed on the bottom surface. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
