| 摘要 |
<P>PROBLEM TO BE SOLVED: To ease a connection between electrodes of a capillary array device and a connection plate for supplying a high voltage to the electrodes. <P>SOLUTION: The connection plate 23 and hollow electrodes 20 are connected without solder but via a spring force. Alternatively, the hollow electrodes 20 can be connected to the connection plate 23 by utilizing volume elasticity of the connection plate. Thus, both of them can be fixed by inserting the hollow electrodes 20 into the connection plate 23 to ease the production of a capillary array. Further, since both of them are joined under pressure by the spring force or volume elasticity, a contact resistance value can be reduced. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
