| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component of a small size, a thin shape, and a low cost with a high degree of reliability in bonding, and to provide its manufacturing method. SOLUTION: An electronic component has a package substrate 23 comprising an insulating substance; a device chip 21 that is flip-chip mounted on the package substrate 23; and a sealing part 25 sealing the device chip 21, and the sealing part 25 has a side part 25A that is formed by solder. The entire sealing part 25 including the side part 25A is formed by solder. The device chip 21 is, for example, an elastic-wave device chip. COPYRIGHT: (C)2006,JPO&NCIPI
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