| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for carrying out a total inspection of bonding conditions of solder balls loaded in a BGA package. SOLUTION: A bottom face of a pressing jig 3 is lowered to a certain height from a bonding face of balls of a BGA package substrate 1 by a pressing head (refer to Fig. 3(a)), so as to take a portion of 2/3 or more of a solder ball 2 into holes 4 of the pressing jig 3 (refer to Fig. 3(b)). A sharing stress of approximately 10% of a diameter of solder balls is applied to solder balls 2 by vibrating a substrate stage 6, and unsuitable solder balls 7 separated from the substrate are removed by lifting while being sucked through the suction hole 5 of the pressing jig 3 (refer to Fig. 3(d)). COPYRIGHT: (C)2006,JPO&NCIPI
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