| 摘要 |
PROBLEM TO BE SOLVED: To provide a developing method and a developing apparatus by which a developer can be uniformly applied on a wafer and the dimensional accuracy of a resist can be improved. SOLUTION: The developing method includes a step to hold a wafer 1 on a stage 2 that is applied by a resist and is exposed, a step to scan-paddle a developer 3 at a specified width in the specified direction on the wafer 1, and a step to control the position of the end face on scanning direction side of the developer. COPYRIGHT: (C)2006,JPO&NCIPI
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