发明名称 SEMICONDUCTOR PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor package which can easily attenuate effectively the positive feedback loop of an electromagnetic wave which propagates a space from the output side of a semiconductor chip to the input side. SOLUTION: The semiconductor package is configured from a semiconductor package base 1 in which the semiconductor chip 3 is carried, and a semiconductor package lid 2 put on the semiconductor package base so that the semiconductor chip may be sealed. A plurality of radio wave absorber strips 10 and 11 are stuck on the semiconductor package lid. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006202827(A) 申请公布日期 2006.08.03
申请号 JP20050010257 申请日期 2005.01.18
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 AKIBA NAOKI;HASE HIDEKAZU
分类号 H01L23/02 主分类号 H01L23/02
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