| 摘要 |
PROBLEM TO BE SOLVED: To raise a cooling performance in a housing for accommodating a wiring board wherein many wiring boards are accommodated. SOLUTION: The housing for accommodating the wiring board includes a sub-rack chassis 2 having a front surface side aperture 2k for accommodating a printed wiring board 9a having exothermic components 9d and a back side aperture 2l for holding the printed wiring board 11a having exothermic components 11d, and a back board 5 for a rear face in which a setting printed wiring board 11a is attached from the back surface in which printed circuit board 11a is attached from the front surface in which the printed circuit boards 9a, 10a internally provided in the sub-rack chassis 2 approximately along the surface formed with the each aperture 2k, 2l and contained from the front surface of the sub-rack chassis 2 are mounted. Inlets 8d for front sides and outlets 2j for the front sides as well as a suction port 2h of rear sides and exhaust port 6d for rear side are formed to the flat surface and the same plane in which the flat surface formed with a transverse plane side aperture 2k is formed, or a back surface side aperture 2l are formed. COPYRIGHT: (C)2006,JPO&NCIPI
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