CURABLE RESIN COMPOSITION,申请号JP20050036719-传众专利搜索

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发明名称	CURABLE RESIN COMPOSITION
摘要	PROBLEM TO BE SOLVED: To provide a curable resin composition which does not contain a heavy metal compound as a curing catalyst and shows a rapid curing rate. SOLUTION: The curable resin composition comprises a curable resin (A) having a group of formula (1) (wherein X is a methoxy group; R<SP>1</SP>is a 1-20C alkyl group and n is 1) within a molecule and at least one compound (B) chosen from a particular Lewis acid and derivatives thereof. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号	JP2006199906(A)	申请公布日期	2006.08.03
申请号	JP20050036719	申请日期	2005.01.18
申请人	KONISHI CO LTD	发明人	NOMURA YUKIHIRO;INUI JUN;SATO SHINICHI
分类号	C08L101/10;C08K3/38	主分类号	C08L101/10
代理机构		代理人
主权项
地址

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