| 摘要 |
There are provided an adhesive composition for bonding two or more different members which can give a bonded material excellent in heat resistance and others with inhibiting breakage of the materials to be bonded by reducing expansion coefficient, and, besides, Young's modulus and proof stress value, a method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method. The above can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and is controlled in expansion coefficient, Young's modulus and proof stress value. |
