| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus where width of wiring connecting a peripheral circuit and an electrode pad is enlarged without increasing a chip size and power supply capacity is increased. <P>SOLUTION: The semiconductor apparatus is provided with an inner circuit 3, a peripheral circuit 4 formed of a plurality of peripheral circuit units arranged at a periphery of the inner circuit 3, and a plurality of electrode pads 2 which are connected to the peripheral circuit units by wiring and are arranged along a periphery of a semiconductor chip. The peripheral circuit units 4A and 4B are arranged along the periphery of the semiconductor chip in staggered arrangement of a plurality of columns. The electrode pads 2A and 2B are disposed in the corresponding peripheral circuit units. A width dimension in the circumferential direction of the peripheral circuit unit can be enlarged. Wiring width of wiring connecting the peripheral circuit units and the electrode pads is increased and power supply capacity in the electrode pads of the semiconductor device is improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
