| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method using printing patterns and a printing pattern forming apparatus for reducing generation of fault, and particularly to provide a method and an apparatus for manufacturing liquid crystal panel. SOLUTION: After formation of a printing pattern such as resist 3 on the film 2 to be etched using a printing method, the thickness reducing process (Fig. (b)) for reducing thickness of resist is implemented using dry etching such as plasma ashing and wet etching such as development process before conducting the process such as etching using the printing pattern as a mask. Accordingly, even if resist is adhered to the unwanted region other than the resist forming region, the adhered resist 4 is removed or reduced in size, and the film 2 to be etched is not left to the lower part of the adhered resist 4 or is very reduced in size. Consequently, generation of fault can be reduced such as point defect due to short-circuit of wires or remaining of patterns or the like. COPYRIGHT: (C)2006,JPO&NCIPI |
