| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing heat expansible microcapsules and hollow resin particles with excellent heat resistance. SOLUTION: The invention relates to the method for producing the heat expansible microcapsules comprising polymer (X) wherein the polymer (X) comprises at least one resins selected from a group comprising polyurethane resins, epoxy resins and polyamide resins. The method for producing expansible microcapsules comprising polymer (X) comprises a step preparing an O/W type emulsion (E) by dispersing a mixture (D) comprising a polymer precursor (a) and a solvent (C), in water, a step mixing the emulsion (E) with a polymer precursor (b) or a solution (F) of (b) and then carrying out an interfacial polymerization. The hollow resin particles are obtained by heating the heat expansible microcapsules. COPYRIGHT: (C)2006,JPO&NCIPI |
