| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing tape which can be properly used for manufacturing an IC chip with a through electrode. SOLUTION: The dicing tape is used for manufacturing the IC chip equipped with a through-electrode. The dicing tape is equipped with a base material and an adhesive layer which is laminated on the base material and 15 to 50μm in thickness. The adhesive layer has a gel molar fraction of 30 to 80% and a storage elastic modulus of 5×10<SP>5</SP>Pa or above at a temperature of 10°C based on the dynamic viscoelasticity measured through a shearing method, under the conditions that the temperature rising rate is set at 3°C/min, the frequency is 10 Hz, and the strain is set at 0.5%. COPYRIGHT: (C)2006,JPO&NCIPI
|
