| 摘要 |
PROBLEM TO BE SOLVED: To provide a connecting device for a semiconductor device in which variation in degree of wear of each bump contact is reduced by suppressing inclination of bump contact when the semiconductor device and the bump contact have contacted. SOLUTION: The connecting device for the semiconductor device comprises a carrier case for housing a semiconductor device 10, a sheet with electrode 5 which is arranged in the carrier case and has a front face wiring 7 conductor-wired on the surface of an insulating substrate 6, a rear face wiring 8 conductor-wired on the rear face of the insulating substrate 6, rear face bump-contact arrangement portion wirings 8A, 8B formed at the rear face wiring, and bump contacts 5A, 5B which are arranged at the contact arrangement portion on the front face and contact the electrode part of the semiconductor device, a pressing member for pressing the semiconductor device to the sheet with electrode 5, and an elastic sheet 4 for contacting the bottom face of the sheet with electrode. The width of the rear face bump-contact arrangement portion wiring 8A at the end part corresponding to the bump-contact 5A contacting the electrode part at the end part of the semiconductor device 10 is formed smaller than the rear face bump-contact arrangement portion wiring 8B on the center side. COPYRIGHT: (C)2006,JPO&NCIPI |
